Two Part Interconnect Polymer——雙部件互連聚合物

簡要描述：用Dyesol的兩部分連接在Dyesol的兩部分中性組裝聚合物結合聚合物創造系列玻璃基板之間的導電連接連接DSC瓷磚。

產品型號：MS004685
廠商性質：代理商
更新時間：2025-07-01
訪問量：1457

產品分類

鈣鈦礦材料

鈣鈦礦前體材料鈣鈦礦前體油墨空穴傳輸材料&摻雜物密封劑添加劑材料/改性劑材料玻璃基板電解質/電解液染料&光敏劑配體材料&中間分子材料二氧化鈦膏&鉑膏查看全部產品

詳細介紹

Dyesol’s Two Part Interconnect Polymer is a black, flexible neutral curing conductive material formulated to provide a series connection, in conjunction with Dyesol’s Two Part Neutral Assembly Polymer, as part of the primary sealing component in Dye Solar Cell prototype tiles. The formulation utilises tungsten metal to achieve conductivity and the cured material exhibits excellent chemical stability. Curing will occur at 50°C with accelerated curing times achieved with temperatures up to 80°C.——Dyesol的兩部分連接的聚合物是一個黑色的、靈活的中性固化導電材料配方，提供一系列的連接，在與Dyesol的兩部分中性聚合物連接組件，作為染料太陽能電池原型磚的主要密封部件的一部分。配方采用鎢金屬實現電導率和固化材料具有優良的化學穩定性TY。固化將發生在50°C與加速固化時間達到溫度高達80°C.

To ensure the tungsten component of the formulation remains evenly suspended the syringes must be shipped in dry ice which incurs an additional shipping fee.
To ensure the tungsten component of the formulation remains evenly suspended during storage the syringes require rotation. Dyesol offers a Syringe Carousel for this purpose.

Consider also purchasing: Dyesol’s Two Part Hermetic Sealing Compound, Two Part Neutral Assembly Polymer, Primary Seal & Interconnect Dispenser, Tile Assembly & Jigging, and Syringe Carousel.

ITEM #	SIZE
MS004685	50 grams

PECIFICATIONS

Quantities:	65ml as a pre-loaded syringe suitable for use in Dyesol’s Primary Seal & Interconnect Dispenser
Curing Temperature:	50-80°C
Mixing Ratio:	By volume 1:1

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Two Part Interconnect Polymer——雙部件互連聚合物

PECIFICATIONS

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