Two Part Thermal Cure Epoxy Compound - Clear——雙組分熱

簡要描述：Use Dyesol’s Two Part Thermal Cure Epoxy Sealing Compound to create a secondary hermetic seal and provide improved mechanical properties in sealing systems for both DSC test cells and tiles.——用Dyesol的

產品型號：MS11111
廠商性質：代理商
更新時間：2025-07-01
訪問量：1392

產品咨詢聯系我們

產品分類

鈣鈦礦材料

鈣鈦礦前體材料鈣鈦礦前體油墨空穴傳輸材料&摻雜物密封劑添加劑材料/改性劑材料玻璃基板電解質/電解液染料&光敏劑配體材料&中間分子材料二氧化鈦膏&鉑膏查看全部產品

詳細介紹

Dyesol’s Two Part Thermal Cure Sealing Compound provides a semi-rigid seal for hermetic enclosure of Dye Solar Cells. It cures at elevated temperature and is clear when cured. This product has very high chemical resistance and clear when cured therefore can also be used for current collector (fingers) protection.

This sealing material provides a secondary seal for primary-sealed test cells and tiles, improving the quality of the hermetic enclosure and contributing desirable mechanical characteristics to sealing systems. Recommended for long term testing programs and any testing at elevated temperatures.

Classified as a ‘Dangerous Good (Corrosive/Dangerous for the environment)’, this product incurs a ‘Dangerous Goods’ fee in addition to normal postage and handling to all destinations.

Consider also purchasing: Dyesol’s Thermoplastic Sealants or Neutral Assembly Polymer.

ITEM #	SIZE
MS11111-50	50 grams
MS11111-100	100 grams
MS11111-250	250 grams

SPECIFICATIONS——規格

Curing Temperature:	120°C
Mixing Ratio:	By Weight 100:40, By volume 2:1
Viscosity (mixed):	4,500 - 5,500 mPa.s measured at shear rate of 10 sec -¹ (25°C)
Pot Life (140g mix):	40-45 minutes

產品咨詢

留言框

產品：
您的單位：
您的姓名：
聯系電話：
常用郵箱：
省份：
詳細地址：
補充說明：
驗證碼：

請輸入計算結果（填寫阿拉伯數字），如：三加四=7

上一篇：MS111100Dimethylammonium iodide
下一篇：MS22222Two Part Thermal Cure Epoxy Compound - Opaque—雙組分熱

Two Part Thermal Cure Epoxy Compound - Clear——雙組分熱

SPECIFICATIONS——規格

留言框

產品：

您的單位：

您的姓名：

聯系電話：

常用郵箱：

省份：

詳細地址：

補充說明：

驗證碼：